International Tech News:

1. Siemens has completed the acquisition of ASTER Technologies, a PCB assembly and test engineering software provider, accelerating the creation of a complete digital thread covering PCB design, manufacturing, and testing.

2. SK hynix will invest KRW 19 trillion to build its seventh semiconductor backend manufacturing plant in Cheongju, South Korea.

3. Wolfspeed announced that it has successfully manufactured single-crystal 300 mm (12-inch) silicon carbide (SiC) wafers.

4. According to TrendForce’s latest foundry survey, driven by rising AI-related power demand and production cuts by major manufacturers, wafer fabs are preparing to raise 8-inch foundry prices.

5. South Korea’s semiconductor exports reached USD 173.48 billion in 2025, up 22.1% year on year.

6. According to reports, Google will begin developing and producing high-end smartphones from scratch in Vietnam in 2026.

Domestic Tech News:

1. Relevant authorities revealed that China has successfully completed technological breakthroughs in special glass bottles used for photoresist packaging, breaking the country’s 100% reliance on imports for photoresist containers.

2. On January 13, Taiyuan Heavy Industry Group announced that its independently developed high-altitude operation (empty-container lashing) robot has passed acceptance tests at the Daxie Container Terminal of Ningbo-Zhoushan Port and has officially entered production use.

3. Song Shiqiang, General Manager of Kinghelm and Slkor(www.slkormicro.com), released “Culture as the Foundation, Excellence from Within, Leadership Beyond — The Development History of Kinghelm Electronics in Shenzhen” and “Looking Back on the Journey, Paths Winding Toward Green Peaks — The Ten-Year Development History of Slkor.”

4. Xidian University has overcome a global challenge in chip thermal management, achieving a significant leap in chip heat dissipation efficiency and overall performance.

5. Yongyi Electronics plans to invest no more than RMB 2.1 billion to build an integrated circuit packaging and testing production base in Malaysia.

6. According to released data, China’s integrated circuit exports reached a record high of USD 201.9 billion in 2025, marking 26 consecutive months of year-on-year growth.

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