International Tech News:

1. STMicroelectronics will develop next-generation panel-level packaging technology through a pilot production line at its Tours, France facility, supported by over $60 million in capital investment.

2. SiTime announced it will leverage its Titan platform to enter the $4 billion resonator market.

3. NVIDIA will invest USD 5 billion in Intel, becoming one of Intel’s largest shareholders.

4. Hanmi Semiconductor announced that its hybrid bonding machine for High Bandwidth Memory (HBM) is expected to be launched in 2027.

5. Microsoft, Nscale, and Aker jointly announced a five-year agreement to build next-generation AI infrastructure in Narvik, Northern Norway, with a total value of up to $6.2 billion.

6. Intel announced that Silver Lake has completed the acquisition of a 51% stake in its FPGA business, making the company the world’s largest independent pure-play FPGA solutions provider.

Domestic Tech News:

1. SMIC’s share price hit a new all-time high, with its market capitalization surpassing RMB 1 trillion during intraday trading.

2. Tongfu Microelectronics has developed and mass-produced large-size FCBGA packages, while ultra-large-size FCBGA packages have completed pre-research and entered formal engineering evaluation.

3. Slkor (slkormicro.com) has successfully concluded its advertising slogan solicitation campaign. The winning results will be announced before September 29.

4. China Mobile Xinsheng has broken through technical barriers and released the country’s first satellite + cellular dual-mode narrowband communication IoT-NTN chip based on a RISC-V core — the CM6650N.

5. Tencent Holdings’ share price rose 2.71%, pushing its market capitalization back to HKD 6 trillion.

6. Fujia Gallium has successfully produced a 6-inch gallium oxide single-crystal ingot in China for the first time using the Vertical Bridgman (VB) method.

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