International Tech News:

1. In 2024, global new photovoltaic installations exceeded 550 GW, a year-on-year growth of nearly 30%. China added 277 GW of new photovoltaic capacity, accounting for 65% of the global total.

2. It is expected that by 2040, the energy consumption of A-class new energy vehicles will drop to below 9.2 kWh/100 km (current mainstream A-class electric vehicles consume about 12–15 kWh/100 km).

3. According to the newly released 2025 Global Unicorn List by Hurun Research Institute, Shenzhen, China, impressively hosts 37 unicorns, with five ranking among the global top 100, including WeBank, Honor, Zhiwang Intelligence, DJI, and Huolala.

4. Edge-side intelligence will drive the global AI SoC market from $43.8 billion in 2025 to $109 billion by 2029, at a compound annual growth rate of 25.6%.

5. “When the golden ‘oranges’ arrive, sincerity comes with it!” Kinghelm (www.kinghelm.com.cn) and Slkor Headquarters have delivered over a hundred boxes of Gannan navel oranges arranged in a “Step-by-Step Rise” formation, symbolizing the companies’ ambition for steadily rising performance and success.

6. ADI, a global leader in high-performance semiconductors, has partnered with Nanjing Hongtai Semiconductor Technology Co., Ltd. to carry out sustained, in-depth collaboration in semiconductor testing and precision signal measurement.

Domestic Tech News:

1. Moore Threads has officially launched its IPO on the STAR Market, with an issue price of RMB 114.28 per share, making it the most expensive new stock of the year.

2. Chip design company GigaDevice plans to mass-produce its self-developed LPDDR4X series products in 2026 and is preparing for the development of small-capacity LPDDR5X products.

3. Shanghai Dongfang Chip Port Integrated Circuit Co., Ltd. has been officially registered with a capital of RMB 39.215 billion, with Zhang Jizhi as the legal representative.

4. Siyano’s advanced memory chip packaging project is located in the Optics Valley East Digital Economy Industrial Park, Wuhan, Hubei, with a total investment of RMB 2.5 billion and planned construction in three phases.

5. Zhongke Changgwang Precision Intelligent Equipment (Suzhou) Co., Ltd. and Soochow University have signed an agreement to jointly establish the “Advanced Semiconductor Integrated Circuit Packaging & Testing Equipment Laboratory” in Kunshan High-tech Zone.

6. The Dongkeng Semiconductor Industrial Park in Shenzhen’s Guangming District is expected to be delivered in Q2 2027, aiming to become a leading semiconductor and integrated circuit industrial cluster in the Guangdong-Hong Kong-Macao Greater Bay Area.

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