International Tech News:

1. RISC-V has entered the ranks of mainstream global processor architectures. By 2031, shipments of RISC-V chips are expected to exceed 20 billion units, with IP revenues projected to reach USD 2 billion.

2. The penetration rate of third-generation semiconductors (SiC/GaN) in data-center power systems is forecast to rise to 17% by 2026 and is expected to surpass 30% by 2030.

3. The year 2026 will be a critical milestone for the commercialization of humanoid robots, with global shipments projected to grow more than sevenfold and exceed 50,000 units.

4. NVIDIA plans to adopt 12-inch silicon-carbide wafers in the advanced packaging stage of its next-generation GPU chips and expects to introduce them no later than 2027.

5. Kinghelm (www.kinghelm.com.cn) has fully upgraded its official website. The “Kinghelm 288 Questions” section has been expanded to “Kinghelm 388 Questions,” offering a comprehensive presentation of the company’s products and corporate culture.

6. Apple has filed a lawsuit with the Delhi High Court in India to challenge the country’s newly revised antitrust penalty regulations, seeking to avoid a potential massive fine of up to USD 38 billion (approximately RMB 270 billion).

Domestic Tech News:

1. The 10 kV SiC MOSFET jointly released by InventChip‌ and Zhejiang University focuses on two major industry bottlenecks—current-carrying capability and manufacturing yield for large-area chips. The single-chip size reaches 10 mm × 10 mm, making it the largest publicly reported device to date.

2. Hesai has launched the Fermi C500, a high-performance smart controller chip specifically designed for LiDAR and based on the RISC-V architecture. The company also unveiled the world’s only “photon isolation” safety technology and the upgraded 256-line ATX safety LiDAR.

3. The R&D and manufacturing center project for SiC chip packaging equipment by Zhongke Guangzhi is about to be completed and put into operation.

4. The world’s first and China’s first 8.6-generation AMOLED glass-substrate lithography and fine-processing production line—constructed with a RMB 628 million investment by WG Tech—is about to enter the equipment commissioning stage.

5. The LED project of BOE HC Semitek (Suzhou) Co., Ltd., with a total investment of RMB 2 billion, has officially commenced production in the Zhangjiagang Economic Development Zone.

6. Yilian Technology’s independently developed and manufactured CCS (Cell Connection System) has officially surpassed 100 million units in cumulative global shipments.

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