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Samsung Electronics Provides NVIDIA with Samples of Second-Generation SOCAMM Next-Gen DRAM Module for Use in NVIDIA's Vera Rubin AI Chip
2025-12-19 95

International Tech News:

1. Texas Instruments (TI) has officially launched its first wafer fab, SM1, and is preparing to ramp up production to tens of millions of chips per day.

2. Japan plans to provide up to 80% guarantees for domestic chipmaker Rapidus, which is seeking to mass-produce cutting-edge semiconductor products.

3. Due to the semiconductor shortage, Honda, a major Japanese automaker, will suspend or reduce production at its factories in Japan and China during the year-end and New Year period.

4. China's sales volume in the third quarter of 2025 increased by 7% year-on-year, expanding its share in the global connected car market to 37% and consolidating its position as the world's largest connected car market.

5. On the morning of December 20th, Qin Xianghong, Chief Engineer of Kinghelm (www.kinghelm.com.cn), delivered a training session on "Product Classification and Related Descriptions on the Kinghelm Website." In the afternoon, Song Shiqiang, the General Manager, conducted training on the "Strategic Planning of Kinghelm and SLKOR," fostering unity and boosting morale!

6. Samsung Electronics has provided NVIDIA with samples of the second generation of its next-generation DRAM module, SOCAMM, which will be applied in NVIDIA's next-generation artificial intelligence (AI) chip, Vera Rubin.

 

Domestic Tech News:

1. The University of Science and Technology of China has successfully realized an electrically pumped, on-chip integrated high-brightness polarization-entangled source, marking a significant step towards integrated quantum information processing.

2. Sugon released the globally leading large-scale intelligent computing system, the scaleX Ten-Thousand-Card Hypercluster, which is the first time a domestically produced ten-thousand-card-level AI cluster system has been unveiled in real form.

3. The signing ceremony for the strategic cooperation project of the Huadong R&D and manufacturing base of Vertiv was held in Suzhou High-tech Zone.

4. Jiangxi Panmeng Semiconductor Technology Co., Ltd. officially announced the completion of an over RMB 100 million Series A+ funding round after signing an investment agreement with Xicheng Jinrui and Jinqiao Fund.

5. OmniVision Group released the industry's first ultra-low-power single-chip silicon-based liquid crystal (LCOS) microdisplay for next-generation smart glasses, the OP03021 LCOS panel.

6. This year, the stock prices of CATL and Sungrow have risen by 45% and 130%, respectively.



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