International Tech News:

1. Japan’s SoftBank Group will acquire data center investment firm DigitalBridge for $4 billion, marking a key step in its AI strategy.

2. Japanese memory chip manufacturer Kioxia’s stock has surged 540% over the past year, with a current market capitalization of approximately ¥5.7 trillion (around $36 billion).

3. According to ZDNet Korea, SK Hynix plans to build a 2.5D production line at its new packaging plant in Luster Pit, Indiana.

4. NVIDIA, SK Hynix, and Phison Electronics will jointly develop a new AI-focused solid-state drive, expected to deliver ten times the performance of the SSDs currently used in AI servers.

5. Semiconductor storage technology company Weebit has licensed its ReRAM technology to Texas Instruments (TI), which is expected to launch embedded processors equipped with ReRAM in the coming years.

6. Investment bank Wedbush released a report listing Microsoft, Palantir, Apple, Tesla, and CrowdStrike as the top five AI-related investment opportunities in 2026, excluding NVIDIA.

Domestic Tech News:

1. Film Hurricane announced a storage card price adjustment, effective from 12:00 on January 5, 2026, with maximum price increases of up to 40%.

2. The China-Malaysia Qinzhou Industrial Park has officially started construction on a high-end semiconductor chemical materials production base with an annual output of 700,000 tons and a planned total investment of ¥5 billion.

3. SLKOR Semiconductor (www.slkormicro.com) successfully achieved its annual performance targets. General Manager Song Shiqiang awarded bonuses to all employees to motivate the team for continued success in 2026.

4. At its supplier conference, CATL announced that in 2026 it will widely deploy sodium batteries across battery swapping, passenger vehicles, commercial vehicles, and energy storage applications.

5. According to SEMI, over 40 new 300mm wafer fabs were built or put into operation in China between 2022 and 2025.

6. Vistar successfully lit up a 0.12-inch Micro-LED microdisplay based on an 8-inch hybrid bonding process.

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