International Tech News:

1. Semiconductor design IP developer SmartDV announced that its MIPI SoundWire I3S 1.0 IP product portfolio has been licensed to multiple customers.

2. Micron Technology’s wafer fab project near Clay, New York, will face another major delay, with production now expected to begin by the end of 2033, instead of the originally planned 2025 start date.

3. According to reports, due to weak sales, Apple will not launch the next-generation iPhone Air 2 in fall 2026 as originally planned.

4. Japan’s SoftBank Group has sold its 32.1 million shares of Indaver stock for $5.83 billion.

5. Tesla is preparing for another expansion of its Texas Gigafactory, planning to build a dedicated facility for its Optimus humanoid robot production.

6. Cadence announced the acquisition of Seattle-based startup Chip Stack. The two companies will collaborate to advance next-generation AI-driven chip design automation.

Domestic Tech News:

1. The manufacturing and packaging-testing project of JCET Group Co., Ltd. (Changjiang Electronics) is expected to begin mass production before the end of the year.

2. Suzhou Novosense Microelectronics Co., Ltd. (Naschip Micro) deeply participated in the drafting of the “Energy-Saving and New Energy Vehicle Technology Roadmap 3.0”, contributing technical insights and industry practices from domestic chip companies.

3. To strengthen the technical reserves of its business team, Slkor Semiconductor(www.slkormicro.com) recently held a special training session; lead FAE engineer Xiong Wenda served as the lecturer and gave a systematic explanation on core products and semiconductor knowledge.

4. According to the latest survey by TrendForce, global smartphone panel shipments reached 586 million units in Q3 2025, with BOE Technology Group Co., Ltd. shipping over 145 million units, maintaining the global number-one position.

5. Chongqing Founder HI-TECH Electronic INC plans to invest RMB 1.364 billion to launch an artificial-intelligence project expansion at its Chongqing production base.

6. A Chinese research team has successfully developed a field-programmable gate array (FPGA) based on wafer-level two-dimensional semiconductor materials.

FAE Engineer Xiong Wenda conducting an on-site training session at Slkor Semiconductor

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