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Chinese electric vehicle manufacturer BYD plans to sell up to 1.6 million vehicles overseas in 2026
2025-11-13 96

International Tech News:

1. Dutch chip equipment manufacturing giant ASML held a completion ceremony for its Hwaseong campus in Hwaseong, Gyeonggi Province, South Korea.

2. South Korea’s 8-inch pure wafer foundry SK keyfoundry is accelerating the development of silicon carbide (SiC) compound power semiconductor technology.

3. In the first three quarters of this year, China’s CATL achieved over RMB 900 billion in exports of its “new three products: electric vehicles, lithium batteries, and photovoltaic cells,” with lithium batteries contributing nearly RMB 400 billion, accounting for more than 40%.

4. Chinese electric vehicle manufacturer BYD plans to sell up to 1.6 million vehicles overseas in 2026.

5. From November 10 to 14, the “Star of the Week” for Kinghelm (www.kinghelm.com.cn) / Slkor is Zeng Qingrong, Director of the Kinghelm Business Department.

6. SK Hynix and SanDisk have begun joint development of HBF and plan to start production in 2027.

 

Domestic Tech News:

1. The research achievement of the School of Electronics at Peking University, “High-Capacity, High-Resolution Ultra-Wideband Silicon-Based Optoelectronic Integrated Chips and Systems,” won the Beijing Natural Science First Prize.

2. Wuhan Xinxin plans to raise RMB 4.8 billion, of which RMB 4.3 billion will be used for the “Phase III project of the 12-inch integrated circuit manufacturing production line.”

3. The Huishang Diamond digital production line project, with a total investment of RMB 1 billion and located in Xiaochi Town, Huangmei County, Hubei Province, has recently entered full-scale construction.

4. The Zhuhai Yiyuan Semiconductor project has a total investment of approximately RMB 10 billion, and Phase I is expected to begin production in February 2026.

5. Lixin Electronics’ one-stop integrated circuit technology service platform has officially opened.

6. A Chinese research team has developed a method for direct wafer bonding and debonding, producing high-quality, wafer-level two-dimensional semiconductor stacks.



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