International Tech News:

1. DARPA and the state of Texas are investing USD 1.4 billion to build a wafer fabrication facility dedicated to researching 3D Heterogeneous Integration (3DHI), stacking, and combining various materials and chip types.

2. SK Hynix will invest at least KRW 128 trillion in the Yongin Semiconductor Cluster to construct a total of four wafer fabs.

3. Shin-Etsu Chemical announced that imec has used QST substrates—a 300 mm gallium nitride (GaN) growth substrate—to produce a 5-μm-thick GaN HEMT structure achieving a breakdown voltage exceeding 650 V.

4. Nokia plans to lay off 800 employees in Germany and intends to close its Munich office by 2030.

5. According to reports, Samsung Electronics of Korea is raising prices on some memory chips this month, with the maximum increase reaching 60% compared with prices in September.

6. LG Energy Solution will build an LFP battery production line at its Ochang Energy Plant in Korea, with full-scale operation beginning in 2027.

Domestic Tech News:

1. XPeng Motors’ revenue in Q3 2025 increased by 101.8% year-on-year to 20.38 billion yuan. Total deliveries reached 116,007 vehicles, a surge of 149.3% compared with 46,533 units in the same period of 2024.

2. A Chinese scientific team has developed a “flash annealing” process capable of heating and cooling at rates of up to 1000 °C per second, successfully producing wafer-level high-performance energy-storage films.

3. This afternoon, GESA Chipshine East China visited SLKOR’s new office. Zhixin Su and Song Shiqiang discussed “Chip-Driven Future, Connecting the World.” Interested friends can scan the QR code to enter the livestream from 15:00 to 18:00—see you there!

4. According to reports, China has conducted 6G technology trials for four consecutive years. The country has now completed the first phase of 6G testing, achieving a reserve of more than 300 key technologies.

5. The 2025 RISC-V Industry Development Conference & RDSA International Forum—RISC-V Parallel Computing Sub-Forum—will be held on the afternoon of November 24 at Hall C, 2nd Floor, Report Hall 2 of the Zhuhai International Convention & Exhibition Center.

6. Loongson’s first GPGPU chip, the 9A1000, completed tape-out at the end of September. The chip integrates both graphics and AI computing power and can be used for AIPC applications.

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